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dear customers, about the change in the name such as "oki electric industry co. ltd." and "oki" in documents to oki semiconductor co., ltd. the semiconductor business of oki electric industry co., ltd. was succeeded to oki semiconductor co., ltd. on oc tober 1, 2008. therefore, please accept that although the terms and marks of "oki electric indust ry co., ltd.", ?oki electric?, and "oki" remain in the documents, they all have been changed to "oki semiconductor co., ltd.". it is a change of the company name, the co mpany trademark, and the logo, etc. , and not a content change in documents. october 1, 2008 oki semiconductor co., ltd. 550-1 higashiasakawa-cho, hachio ji-shi, tokyo 193-8550, japan http://www.okisemi.com/en/
fedr27t1602l-002-03 issue date: jan.06, 2009 mr27t1602l 1m?word 16?bit or 2m?word 8?bit p2rom 1/11 features 1,048,576-word 16-bit / 2,097,152-word 8-bit electrically switchable configuration +2.7 v to 3.6 v power supply access time 70 ns max operating current 16 ma max (5mhz) standby current 10 a max input/output ttl compatible three-state output packages mr27t1602l-xxxma 44-pin plastic sop (sop44-p-600-1.27-k) mr27t1602l-xxxtn 48-pin plastic tsop (tsop i 48-p-1220-0.50-1k) MR27T1602L-XXXLA 48-ball bga (bga48-6.0x8.0-0.8) p2rom advanced technology p2rom stands for production programmed rom. this exclusive oki semiconductor technology utilizes factory test equipment for programming the customers code into the p2rom prior to final production testing. advancements in this technology allows production costs to be equivalent to maskrom and has many advantages and added benefits over the other non-volatile technologies, which include the following; short lead time , since the p2rom is programmed at the final stage of the production process, a large p2rom inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liabil ity as a custom product. no mask charge , since p2roms do not utilize a custom mask for storing customer code, no mask charges apply. no additional programming charge, unlike flash and otp that require additional programming and handling costs, the p2rom al ready has the code loaded at the factory with minimal effect on the production throughput. the cost is included in the unit price. custom marking is available at no additional charge. pin compatible with mask rom and some flash product 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 a15 a14 a13 a12 a11 a10 a9 a8 a19 nc nc nc nc nc nc a18 a17 a7 a6 a5 a4 a3 a2 a1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48tsop(type-i) 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 nc a18 a17 a7 a6 a5 a4 a3 a2 a1 a0 ce# v ss oe# d0 d8 d1 d9 d2 d10 d3 d11 nc a 19 a 8 a 9 a 10 a 11 a 12 a 13 a 14 a 15 a 16 byte# v ss d15/a?1 d7 d14 d6 d13 d5 d12 d4 v cc 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44sop a 16 byte# v ss d15/a?1 d7 d14 d6 d13 d5 d12 d4 v cc d11 d3 d10 d2 d9 d1 d8 d0 oe# v ss ce# a 0 pin configuration (top view)
fedr27t1602l-002-03 mr27t1602l / p2rom 2/11 pin configuration (top view): bga packages 48-ball bga top view - ball side down a 3 a 7 nc nc a 9 a 13 a 4 a 17 nc nc a 8 a 12 a 2 a 6 a18 nc a 10 a14 a 1 a 5 nc a 19 a11 a15 a 0 d0 d2 d5 d7 a16 ce# d8 d10 d12 d14 byte# oe# d9 d11 v cc d13 d1 d3 d4 d6 v ss v ss 1 2 3 4 5 6 a b c d e f g h d15 / a?1
fedr27t1602l-002-03 mr27t1602l / p2rom 3/11 block diagram pin descriptions pin name functions d15 / a?1 data output / address input a0 to a19 address inputs d0 to d14 data outputs ce# chip enable input oe# output enable input byte# word / byte select input v cc power supply voltage v ss ground nc no connect a0 a1 a2 a3 a4 a5 a6 a7 a8 a9 a10 a11 a12 a13 a14 a15 a16 a17 a18 a19 ce# byte# oe# ce oe 8/ 16 switch d0 d2 d4 d6 d8 d10 d12 d14 d1 d3 d5 d7 d9 d11 d13 d15 memory cell matrix 1m 16-bit or 2m 8-bit multiplexer output buffer row decoder column decoder address buffer in 8-bit output mode, these pins are placed in a high-z state and pin d15 functions as the a-1 address pin. a?1
fedr27t1602l-002-03 mr27t1602l / p2rom 4/11 function table mode ce# oe# byte# v cc d0 to d7 d8 to d14 d15/a?1 read (16-bit) l l h d out read (8-bit) l l l d out hi?z l/h h output disable l h l hi?z ? h standby h ? l 3.0 v hi?z ? ? : don?t care (h or l) absolute maximum ratings parameter symbol condition value unit operating temperature under bias ta 0 to 70 c storage temperature tstg ? ?55 to 125 c input voltage v i ?0.5 to v cc +0.5 v output voltage v o ?0.5 to v cc +0.5 v power supply voltage v cc relative to v ss ?0.5 to 5 v power dissipation per package p d ta = 25c 1.0 w output short circuit current i os ? 10 ma recommended operating conditions (ta = 0 to 70c) parameter symbol conditio n min. typ. max. unit v cc power supply voltage v cc 2.7 ? 3.6 v input ?h? level v ih 2.2 ? v cc +0.5 ? v input ?l? level v il v cc = 2.7 to 3.6 v ?0.5 ?? ? 0.6 v voltage is relative to vss. ? : vcc+1.5v(max.) when pulse width of overshoot is less than 10ns. ?? : -1.5v(min.) when pulse width of undershoot is less than 10ns. pin capacitance (v cc = 3.0 v, ta = 25c, f = 1 mhz) parameter symbol conditio n min. typ. max. unit input c in1 ? ? 8 byte# c in2 v i = 0 v ? ? 120 output c out v o = 0 v ? ? 10 pf
fedr27t1602l-002-03 mr27t1602l / p2rom 5/11 electrical characteristics dc characteristics (v cc = 2.7 v to 3.6 v, ta = 0 to 70c) parameter symbol conditio n min. typ. max. unit input leakage current i li v i = 0 to v cc ? ? 10 a output leakage current i lo v o = 0 to v cc ? ? 10 a i ccsc ce# = v cc ? ? 10 a v cc power supply current (standby) i ccst ce# = v ih ? ? 1 ma v cc power supply current (read) i cca ce# = v il , oe# = v ih f=5mhz ? ? 16 ma input ?h? level v ih ? 2.2 ? v cc +0.5 ? v input ?l? level v il ? ?0.5 ?? ? 0.6 v output ?h? level v oh i oh = ?1 ma 2.4 ? ? v output ?l? level v ol i ol = 2 ma ? ? 0.4 v voltage is relative to v ss . ? : vcc+1.5v(max.) when pulse width of overshoot is less than 10ns. ?? : -1.5v(min.) when pulse width of undershoot is less than 10ns. ac characteristics (v cc = 2.7 v to 3.6 v, ta = 0 to 70c) parameter symbol condit ion min. max. unit address cycle time t c ? 70 ? ns address access time t acc ce# = oe# = v il ? 70 ns ce# access time t ce oe# = v il ? 70 ns oe# access time t oe ce# = v il ? 25 ns t chz oe# = v il 0 30 ns output disable time t ohz ce# = v il 0 25 ns output hold time t oh ce# = oe# = v il 0 ? ns measurement conditions input signal level------------------------------------ 0 v / vcc input timing reference level ---------------------- 1/2 vcc output load------------------------------------------- 50 pf output timing reference level-------------------- 1/2 vcc output load output 50 pf (including scope and jig)
fedr27t1602l-002-03 mr27t1602l / p2rom 6/11 timing chart (read cycle) 16-bit read mode (byte# = v ih ) 8-bit read mode (byte# = v il ) a-1 to a19 ce# oe# d0 to d7 t c t ce t oe t oh t chz t ohz valid data hi-z hi-z t oh valid data t acc t c t acc a0 to a19 ce# oe# d0 to d15 t c t ce t oe t oh t chz t ohz valid data hi-z hi-z t oh valid data t acc t c t acc
fedr27t1602l-002-03 mr27t1602l / p2rom 7/11 package dimensions notes for mounting the surface mount type package the surface mount type packages are ve ry susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact oki semiconductor?s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (unit: mm)
fedr27t1602l-002-03 mr27t1602l / p2rom 8/11 notes for mounting the surface mount type package the surface mount type packages are ve ry susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact oki semiconductor?s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, tem perature and times). (unit: mm)
fedr27t1602l-002-03 mr27t1602l / p2rom 9/11 notes for mounting the surface mount type package the surface mount type packages are ve ry susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact oki semiconductor?s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (unit: mm)
fedr27t1602l-002-03 mr27t1602l / p2rom 10/11 revision history page document no. date previous edition current edition description fedr27t1602l-02-01 dec. 08, 2004 ? ? final edition 1 1, 5 1, 5 change tc, tacc, tce to 70ns change toe to 25ns change tchz, tohz to 20ns 5 5 changed input signal level from ?0v/3v? to ?0v/vcc? fedr27t1602l-002-02 oct. 30, 2008 ? ? changed company logo and name to oki semiconductor fedr27t1602l-002-03 jan. 6, 2009 1 1,2,7,9 add mr27t1602l-xxxma(44sop package)/ MR27T1602L-XXXLA (bga package)
fedr27t1602l-002-03 mr27t1602l / p2rom 11/11 notice 1. the information contained herein can change without notice owing to product and/or technical improvements. before using the product, please make sure that the information being referred to is up-to-date. 2. the outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. wh en planning to use the product, please ensure that the external conditions are reflected in the act ual circuit, assembly, and program designs. 3. when designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including , but not limited to, operating voltage, power dissipation, and operating temperature. 4. oki semiconductor assumes no re sponsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, im proper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or opera tion outside the specified operating range. 5. neither indemnity against nor license of a third party?s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. no responsibility is assumed by us for any infringement of a third party?s right which may result from the use thereof. 6. the products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). these products are not, unless specifically au thorized by oki semiconductor authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or app lication where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. such applications include, but are not limited to, tra ffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. certain products in this document may need government approval before they can be exported to particular countries. the purchaser assumes the responsibility of de termining the legality of export of these products and will take appropriate and necessary st eps at their own expense for these. 8. no part of the contents contained herein may be reprinted or reproduced without our prior permission. copyright 2009 oki semiconductor co., ltd.

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